Category Press releases

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Kyocera Develops Breakthrough Multilayer Ceramic Core Substrate for Advanced AI Semiconductors

Kyocera Corporation (President: Shiro Sakushima; “Kyocera”) today announced that it is commercializing a new multilayer ceramic core substrate for advanced semiconductor packages, such as xPUs(1) and switch ASICs, which are rapidly scaling in complexity as…

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GigaDevice Unveils GD32F5HC Microcontroller Series, Advancing High-Performance Edge HMI and IoT Innovation

GigaDevice Unveils GD32F5HC Microcontroller Series, Advancing High-Performance Edge HMI and IoT Innovation

GigaDevice, a leading global supplier of semiconductor devices, today announced the official launch of the GD32F5HC series of general-purpose 32-bit microcontrollers . Designed to deliver a compact form factor, high-frequency operation, ample memory,…

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