STMicroelectronics Expands Edge-AI Sensor Family with Inertial Module for Advanced Movement Analysis

STMicroelectronics Introduces LSM6DSV32X Inertial Module for High-Performance Movement Analysis STMicroelectronics has unveiled the LSM6DSV32X 6-axis inertial module (IMU), designed to meet the demands of intensive movement analysis. Featuring a broad accelerometer full-scale range of 32g and a 4000 degrees-per-second (dps) gyroscope, this sensor excels in measuring dynamic movements and impacts, including precise freefall height estimation. Positioned to drive the next wave of edge-AI applications, the LSM6DSV32X empowers enhanced functionality and extended battery life in various consumer wearables, asset trackers, and safety devices like impact and fall alarms for workers.

The LSM6DSV32X extends the lineage of intelligent sensors integrated with ST’s machine-learning core (MLC), featuring AI algorithms rooted in decision trees. Equipped with MLC for context awareness and a finite state machine (FSM) for motion tracking, these sensors empower developers to incorporate novel features, reduce latency, and conserve power consumption. Leveraging the built-in features, the LSM6DSV32X significantly reduces power consumption for functions like gym-activity recognition to less than 6µA. Moreover, the LSM6DSV32X incorporates ST’s Sensor Fusion Low-Power (SFLP) algorithm, enabling 3D orientation tracking at a mere 30µA. Through support for adaptive self-configuration (ASC), the module dynamically adjusts sensor settings in real-time to continuously enhance performance and efficiency.

Beyond the accelerometer and gyroscope, the LSM6DSV32X integrates ST’s Qvar electrostatic charge-variation sensing technology, enabling advanced user-interface functionalities such as touch, swipe, and tap recognition. The module also features an analog hub for seamless acquisition and processing of external analog signals.

To expedite time to market for new products, developers can leverage a wide array of ready-to-use libraries and tools. These resources include the intuitive MEMS Studio environment for evaluation and use-case development, alongside a dedicated GitHub repository housing code examples like sports-activity and head-gesture recognition. Additionally, hardware adapters are available to facilitate connectivity with ST’s evaluation and proof-of-concept boards such as the ProfiMEMS board, Nucleo sensor expansion board, and Sensortile.box PRO.

The LSM6DSV32X is slated to commence volume production in May 2024, packaged in a compact 2.5mm x 3mm x 0.83mm 14-lead LGA package. For sample requests and pricing details, interested parties can reach out to local ST sales offices. Pricing for the LSM6DSV32X starts from $2.98 for orders of 1000 pieces.

For further information, please visit https://www.st.com/lsm6dsv32x.

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