Allegro DVT announced its participation in the European CHASSIS program’s Automotive Base Die. This 5-nanometer die will revolutionize the automotive semiconductor industry, laying the foundation for an open, standardized die ecosystem and driving the development of next-generation software-defined vehicles.
The Automotive Base Die is the core communication and integration hub of the automotive System-on-a-Chip (SoC) infrastructure, designed to achieve seamless integration of third-party dies through the Universal Die Interconnect (UCIe) standard. Funded by leading European entities—BMW, imec, and Bosch—under the Chips JU CHASSIS framework, the Automotive Base Die aims to bring unprecedented flexibility and innovation to the automotive industry.
Allegro DVT’s expertise played a crucial role in the development of this foundational technology. Specifically, Allegro DVT provided its encoding and decoding semiconductor video IP solutions , helping to build optimized, high-performance video pipelines for chip-based automotive systems. This includes advanced video IP for automotive camera systems such as ADAS (Advanced Driver Assistance Systems), surround view systems, and in-vehicle infotainment applications, supporting multiple high-resolution video streams.
Leveraging Allegro DVT’s deep expertise in video compression and real-time video processing, this solution is designed to meet the stringent requirements of next-generation vehicles for memory bandwidth optimization, processing latency, and power consumption, while ensuring scalable and efficient integration across heterogeneous chips.
“We are very proud to be an important partner in the CHASSIS program and to contribute to this transformative European automotive project,” said Nouar Hamze, CEO of Allegro DVT. “Our encoding and decoding semiconductor video IP solutions are a perfect fit for the goals of automotive base chips, enabling high-performance video processing for next-generation automotive platforms. This collaboration demonstrates our commitment to driving innovation and establishing open standards for software-defined vehicles.”
The CHASSIS project, coordinated by Bosch, is a three-year European research project dedicated to creating an open die ecosystem for safe and scalable technologies for software-defined mobility. Automotive-based die is a key step in achieving CHASSIS’s goal of establishing a standardized, open die platform to drive industry competition and innovation.
By supporting early interoperability testing with other chips and accelerating the Europe-centric design process, automotive base chips are expected to enhance Europe’s position in advanced semiconductor design and manufacturing, while creating a more agile and innovative automotive supply chain.
The CHASSIS project received funding support from the Chips Joint Executive Agency (Chips JU) and relevant national authorities under funding agreement No. 101252788.
Regarding Allegro DVT
Founded in 2003 and headquartered in France, Allegro DVT is a leading global supplier of digital video technology solutions, with products covering semiconductor video intellectual property (IP), video compliance testing tools, and digital TV receiver testing solutions.
Source link:https://www.businesswire.com/
