SkyWater, a trusted leader in technology realization, has announced the appointment of Bassel Haddad as Senior Vice President and General Manager of Advanced Packaging. Reporting to President and COO John Sakamoto, Haddad will be tasked with expanding and scaling SkyWater’s advanced packaging division to serve both the defense and commercial sectors. His responsibilities will include overseeing technology development, engineering, marketing, and operations at the Florida fabrication facility. Additionally, he will work to enhance collaborations with the advanced packaging ecosystem, engaging with government partners, technology centers, and universities.
John Sakamoto expressed enthusiasm about Haddad’s appointment, stating, “Bassel will lead the drive to accelerate the growth of our advanced packaging business. His experience in the commercial sector will be crucial in developing new customer relationships and partnerships to strengthen our commercial manufacturing presence. Bassel’s successful track record at Intel, where he managed large-scale business lines and engineering projects, demonstrates his ability to convert strategies into operational success. We are eager to see the positive impact of his leadership on our advanced packaging business.”
Haddad brings a wealth of experience in business strategy, P&L management, and the execution of engineering projects and operations. With deep expertise in silicon, platforms, and systems across various markets—including enterprise, edge compute, and mobile—Haddad has a proven history of driving business growth. Prior to joining SkyWater, he held significant roles at Intel since 2011, most recently as Vice President and General Manager of Edge Device & AI Products. There, he managed a multi-billion dollar P&L and led innovations in edge AI and IoT. His earlier roles included platform architecture, silicon development, and systems and software engineering. Haddad holds both a Bachelor’s and Master’s degree in Electrical Engineering from Technion – Israel Institute of Technology.
Commenting on his new role, Haddad said, “As Moore’s Law slows, 2.5D and 3D advanced packaging represent the next frontier of semiconductor technology innovation. The growing demand for computation in the AI era makes heterogeneous integration crucial for the next phase of semiconductor growth. SkyWater is well-positioned to be a leading domestic supplier of advanced packaging solutions for both defense and commercial customers. I am excited to join SkyWater and look forward to driving the business forward through continued innovation and operational excellence.
