Thintronics Inc. has successfully closed its Series A Extension round, bringing in key strategic investors including M Ventures, the corporate venture capital (CVC) arm of Merck KGaA, TGVP, the U.S. CVC arm of TOPPAN Holdings, and returning investor Tallwood Venture Capital. This extension was led by Maverick Capital and Translink Capital, further strengthening Thintronics’ financial backing. Based in California, Thintronics is an innovative electronic materials startup specializing in high-performance insulators for advanced AI datacenter, networking, and RF/millimeter-wave (mmW) applications.
Thintronics was founded on the belief that traditional approaches to insulator material development were hindering industry innovation. The company has since created a suite of advanced materials that surpass current electrical and mechanical standards. Stefan Pastine, CEO of Thintronics, emphasizes the crucial role of interconnect insulators in modern electronics, noting that current insulators are far from optimized. Thintronics’ goal is to refine these materials to operate near their theoretical insulation limits and streamline the fragmented supply chain across various electronic architectures.
The company’s insulators exhibit stability at high frequencies, using a new generation of isotropic, skew-free, ultra-low loss, and low dielectric constant (Dk) materials. These insulators can be applied as ultra-thin coatings directly onto chips and interconnects, serving as advanced insulation layers that minimize signal loss and energy dissipation in high-speed data channels. This innovation leads to significant reductions in energy loss and heat dissipation in data centers. Additionally, Thintronics has moved away from using fiberglass to provide structural rigidity for printed circuit boards (PCBs), enabling unprecedented flexibility for high-performance boards and semiconductors.
The addition of M Ventures, TGVP, and Tallwood to the investor syndicate brings significant strategic advantages for Thintronics. M Ventures offers a crucial partnership with Merck KGaA, a leading global provider of semiconductor materials. TGVP integrates Thintronics into TOPPAN’s ecosystem, a major global supplier of semiconductor packaging materials and insulator materials. Tallwood, a long-term semiconductor investor and early supporter of Thintronics, contributes valuable strategic intelligence and technical resources that will accelerate the company’s commercialization efforts.
Issei Kusano of TGVP highlighted the potential of Thintronics’ technology, noting its outstanding electronic and mechanical properties. He stated that TOPPAN’s semiconductor back-end business could unlock and expand Thintronics’ value, potentially revolutionizing the packaging market. Owen Lozman of M Ventures echoed this sentiment, expressing confidence in Thintronics’ technology at a time when the demand for data and computing power is hitting technical barriers. He emphasized that only material innovation can address these challenges, and M Ventures is proud to support Thintronics in driving this disruptive breakthrough.
Stefan Pastine, CEO of Thintronics, expressed excitement about the additional support, acknowledging the deep expertise and strategic insights in semiconductor materials and packaging that these new investors bring. He extended his thanks to Daniel Franke, Owen Lozman, Yuhei Yano, Ed L., and Yoji Kawaguchi for their belief in Thintronics’ vision, team, and technology.
Tristan El Bouayadi, CTO of Thintronics, emphasized the value of these new partnerships, especially as the market demands simpler integration schemes with higher performance in terms of signal integrity, power integrity, and thermomechanical reliability. He noted that Thintronics will play a crucial role as an ecosystem enabler for architectures like Interposer-less 2.1D, Chiplets, and Heterogeneous Co-packaging. This investment, he said, aligns perfectly with Thintronics’ technical and commercial roadmap.
