StratEdge Prepares for Dual March Exhibitions Showcasing Advanced Packaging Technologies
StratEdge Corporation, a recognized innovator in the design, production, and assembly of high-frequency, high-power, and high-reliability semiconductor packages, is preparing to present its latest molded ceramic and gold-plated tab product lines at two prominent industry exhibitions taking place in March. With more than four decades of experience supporting demanding RF, microwave, defense, aerospace, and commercial markets, the company continues to demonstrate its commitment to advancing semiconductor packaging solutions that address performance, durability, and manufacturability challenges. Attendees will have the opportunity to connect directly with StratEdge’s technical and sales experts to explore packaging strategies optimized for next-generation high-frequency and high-power devices operating in increasingly rigorous environments.
Exhibition Presence at IMAPS Device Packaging Conference
StratEdge will exhibit at the IMAPS Device Packaging Conference, scheduled for March 3–4 in Phoenix. The IMAPS Device Packaging Conference is widely regarded as a premier gathering for professionals in microelectronics packaging, assembly, and interconnect technologies. The event brings together engineers, designers, manufacturers, and technology leaders to discuss advancements in device packaging, materials innovation, thermal management, and reliability enhancement. StratEdge’s presence at this conference reflects its ongoing role as a trusted packaging partner for engineers seeking solutions that deliver consistent electrical performance, efficient thermal dissipation, and long-term reliability. During the exhibition, company representatives will highlight how molded ceramic packages and gold-plated tabs can support evolving system architectures, particularly in RF and microwave applications where precision and durability are essential.
Participation in GOMACTech Conference and Exhibition
Following the Phoenix event, StratEdge will participate in the GOMACTech exhibition, taking place March 10–11 in New Orleans. GOMACTech is known for its focus on government and military microelectronics applications, providing a collaborative forum for defense agencies, contractors, and commercial technology providers to explore cutting-edge innovations. StratEdge’s molded ceramic packaging solutions are particularly well-suited to this audience due to their proven compliance with rigorous MIL-STD reliability standards and their ability to withstand harsh environmental conditions. By exhibiting at GOMACTech, StratEdge underscores its dedication to supporting mission-critical systems where performance, resilience, and consistency are non-negotiable requirements.
Gold-Plated Tabs Designed for High-Power Die Attachment
One of the central technologies StratEdge will feature at both exhibitions is its line of gold-plated tabs engineered to support eutectic die attachment of gallium nitride and other high-frequency, high-power semiconductor devices. Gallium nitride, widely known for its superior efficiency and power density, has become a foundational material in RF amplification, radar systems, satellite communications, and electronic warfare platforms. StratEdge’s gold-plated tabs enable robust eutectic die attachment processes utilizing gold-tin and gold-silicon alloys, both of which provide strong mechanical bonds, excellent thermal conductivity, and reliable electrical performance. These attachment methods are essential in applications where devices must operate under high thermal loads while maintaining stable performance across extended duty cycles. By optimizing tab surface finishes and material properties, StratEdge ensures consistent solder wetting and bond integrity, supporting the stringent requirements of modern high-frequency systems.
Chip-on-Board Solutions for Temperature-Sensitive Substrates
In addition to supporting eutectic die attachment, StratEdge’s gold-plated tabs play a critical role in chip-on-board assembly processes. For chip-on-board applications, the semiconductor die is first attached directly to the ceramic metal composite tab before the tab is mounted onto the printed circuit board. This methodology is particularly advantageous for organic circuit boards that cannot tolerate the elevated temperatures associated with traditional eutectic die attachment directly on the board. By completing the high-temperature bonding step at the tab level, manufacturers can protect sensitive substrates from thermal damage while still benefiting from the performance advantages of eutectic attachment. This workflow enhances manufacturing flexibility and can streamline production for systems operating in Ku through E frequency bands, where minimizing parasitics and maintaining signal integrity are critical design priorities.
Molded Ceramic Packages for RF and Microwave Performance
StratEdge will also showcase its molded ceramic package portfolio, including MC Series configurations tailored for RF and microwave applications operating up to 18 GHz. Molded ceramic packages offer a compelling balance of electrical performance, mechanical strength, and environmental protection. The company provides more than 200 standard outlines, giving engineers extensive design flexibility when selecting package geometries that align with their system footprints and performance objectives. Molded ceramic materials inherently support excellent thermal conductivity and dimensional stability, making them ideal for high-power amplifiers, oscillators, filters, and other microwave components. By offering standardized outlines alongside customization options, StratEdge enables customers to accelerate development timelines without sacrificing reliability or performance.
Reliability for Defense, Aerospace, and Harsh Environments
Reliability remains a cornerstone of StratEdge’s product philosophy. Molded ceramic packages are designed to meet or exceed MIL-STD reliability standards, ensuring dependable operation in defense aerospace applications and other harsh environments. Systems deployed in military aircraft, space platforms, naval vessels, and ground-based radar installations must endure extreme temperature fluctuations, vibration, humidity, and mechanical shock. StratEdge’s packaging technologies are engineered with these stress factors in mind, incorporating materials and processes that preserve hermeticity, structural integrity, and electrical consistency over extended operational lifetimes. The company’s long-standing expertise in high-reliability packaging allows it to support customers developing mission-critical technologies where failure is not an option.
Balancing Power, Manufacturability, and System Integration
According to Casey Krawiec, Vice President of Sales at StratEdge, the company’s team is prepared to help engineers evaluate die-on-tab workflows and packaging options that strike an optimal balance between power handling, reliability, and manufacturability. With more than 40 years of experience designing and manufacturing packages for high-frequency, high-power, and high-reliability devices, StratEdge recognizes that each application presents unique trade-offs. While the company advocates for the advantages of packaged solutions, it also acknowledges that system designers operating in Ku through E bands may determine that chip-on-board approaches using tabs offer distinct benefits in terms of footprint reduction, thermal management, or cost considerations. By engaging directly with engineers at industry events, StratEdge aims to provide practical guidance that aligns packaging strategies with overall system performance goals.
Four Decades of Packaging Expertise
Over its four-decade history, StratEdge has built a reputation for technical rigor and customer collaboration. The company’s design and manufacturing capabilities encompass advanced ceramic processing, precision metallization, assembly services, and quality assurance protocols tailored to high-reliability markets. This comprehensive expertise allows StratEdge to address the full lifecycle of packaging development, from initial concept and prototyping to volume production and long-term supply support. By continually investing in materials science, manufacturing processes, and quality systems, StratEdge maintains its position at the forefront of high-frequency and high-power packaging innovation.
Supporting the Next Generation of High-Frequency Systems
As RF and microwave technologies continue to evolve toward higher frequencies, greater power densities, and more compact system architectures, the importance of advanced packaging solutions becomes increasingly pronounced. Effective packaging must manage heat efficiently, minimize parasitic effects, and safeguard delicate semiconductor structures from environmental stress. StratEdge’s molded ceramic packages and gold-plated tabs directly address these requirements, enabling engineers to design systems capable of delivering reliable performance in commercial communications, defense electronics, aerospace platforms, and emerging high-frequency applications. Through its participation at both the IMAPS Device Packaging Conference and GOMACTech, StratEdge reaffirms its commitment to collaborating with the engineering community and providing packaging solutions that power the future of high-frequency innovation.
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