StratEdge Showcases Rugged High-Frequency and High-Power Packaging Solutions for Harsh Environments at iMAPS HiTEC and CMSE 2025
StratEdge Corporation, a recognized leader in the design, manufacture, and assembly of high-frequency and high-power semiconductor packages, will spotlight its latest innovations in high-temperature packaging technology at two upcoming premier industry events. The company is set to exhibit at the iMAPS HiTEC Power Packaging Conference, taking place April 14–17 in Albuquerque, New Mexico, and at the Components for Military & Space Electronics (CMSE) conference, which will be held April 29–May 1 in Los Angeles, California, where StratEdge will be located at Booth B20.
These appearances underscore StratEdge’s ongoing commitment to pushing the boundaries of what semiconductor packaging can achieve—especially in environments where extreme conditions demand unmatched reliability, thermal performance, and electrical integrity.
Advancing High-Temperature Packaging for the World’s Toughest Applications
As the demand for electronic devices that can perform reliably in harsh operating environments continues to grow, StratEdge has positioned itself at the forefront of the industry by offering cutting-edge packaging solutions designed for high-frequency and high-power applications. From scorching automotive under-hood conditions to the intense thermal demands inside jet engines, from deep-earth drilling sites to the vacuum of space, StratEdge packages are engineered to deliver long-term performance where failure is not an option.
Among the technologies being highlighted at iMAPS HiTEC and CMSE 2025 is StratEdge’s molded ceramic package line, which combines high thermal conductivity, excellent electrical performance, and mechanical durability. These packages are ideally suited for high-frequency devices operating up to 18 GHz, and offer a wide variety of standard configurations—with more than 200 package outlines available to meet diverse design needs.
Crucially, many of StratEdge’s open-tooled packages come equipped with 50-ohm impedance high-frequency transitions, a feature that simplifies the integration of advanced semiconductor devices by ensuring signal integrity and impedance matching right out of the box. These features are especially attractive to developers working with gallium arsenide (GaAs) and gallium nitride (GaN) devices in cutting-edge defense, aerospace, and telecommunication systems.
Built for Performance in Extreme Environments
According to Casey Krawiec, Vice President of Global Sales at StratEdge, the company’s molded ceramic packages are increasingly favored in applications where devices are subjected to exceptionally high operating temperatures and harsh mechanical stress.
Our molded ceramic packages are extremely popular where devices encounter harsh environments,” said Krawiec. “Testing has shown they can withstand extended exposures at over 500°C, which is why they’re selected for automotive, down-hole drilling, jet engine, and other high-temperature applications, as well as for traditional aerospace and defense systems.”
The high-temperature stability of StratEdge’s packaging is complemented by its robust thermal dissipation capabilities, which are critical in applications involving high power levels. As electronic devices grow more powerful and compact, efficient heat management has become essential to preserving performance and preventing failure. StratEdge addresses this challenge through materials engineering and precise package design that enable efficient heat flow away from the semiconductor die.
In many cases, these packages are part of larger power amplifier systems, RF front ends, or radar modules, where maintaining signal integrity and device longevity under continuous thermal and electrical load is vital.
Supporting High-Reliability Markets with Proven Solutions
StratEdge’s packaging technology is widely used across several sectors where reliability and performance are paramount. These include:
- Telecommunications – Supporting high-speed 5G, satellite, and broadband wireless infrastructure.
- Defense and Aerospace – Providing rugged packages for radar, electronic warfare, satellite communications, and navigation systems.
- Automotive – Enabling next-generation electrification, powertrain control, and advanced driver assistance systems (ADAS).
- Energy Exploration – Delivering reliable performance in down-hole environments for oil and gas exploration.
- Clean Energy – Supporting high-efficiency power electronics in renewable energy systems such as wind and solar inverters.
- Test and Measurement – Ensuring accuracy and reliability in high-frequency measurement instrumentation.
With a comprehensive product line that includes both post-fired ceramic and lower-cost molded ceramic options, StratEdge is well positioned to offer tailored packaging solutions that meet technical specifications and budgetary constraints alike.
Enabling Seamless Integration with Industry Standards
A significant advantage of StratEdge’s offerings is the company’s attention to industry compliance and integration standards. All StratEdge packages are lead-free, with most models meeting RoHS (Restriction of Hazardous Substances) and WEEE (Waste Electrical and Electronic Equipment) directives—an important consideration for global manufacturers operating in regulated markets.
StratEdge’s Santee, California manufacturing facility is both ITAR (International Traffic in Arms Regulations) registered and ISO 9001:2015 certified, ensuring high-quality production processes and the ability to serve sensitive defense-related contracts. The facility includes cleanroom assembly services and is equipped to handle both low-volume prototyping and full-scale production runs.
Engaging with the Industry: In-Person and Online
Visitors to the iMAPS HiTEC and CMSE conferences will have the opportunity to interact with StratEdge’s team of technical experts, explore product samples, and gain deeper insights into the advantages of molded ceramic packaging technology. The company’s presence at these events underscores its dedication to collaborative innovation and customer support.
Those unable to attend the events in person can still learn about StratEdge’s capabilities through a virtual tour of the facility, available on YouTube at https://youtu.be/ewJuORN5vyQ, or by browsing the company’s website at www.stratedge.com.
About StratEdge Corporation
StratEdge Corporation specializes in designing, manufacturing, and assembling high-performance semiconductor packages capable of operating from DC to beyond 63 GHz. The company is known for its advanced packaging for GaAs and GaN devices, which are essential components in high-frequency and high-power systems.
With a broad range of packaging technologies—including post-fired and molded ceramic packages—StratEdge offers comprehensive solutions tailored to the needs of 5G, satellite, defense, clean energy, test and measurement, and automotive sectors. The company’s packages are engineered for long-term reliability, excellent thermal management, and optimal RF performance, helping customers bring high-performance devices to market quickly and cost-effectively.
Operating out of its Santee, California headquarters, StratEdge combines U.S.-based production with global technical support to deliver packaging solutions that meet the most demanding application requirements.
