The OKI Group’s PCB business subsidiary, OKI Circuit Technology (led by President Masaya Suzuki and headquartered in Tsuruoka City, Yamagata Prefecture), has launched a new ultra-high-multilayer PCB production line at its Joetsu Plant in Joetsu City, Niigata Prefecture. Full-scale operations began in July. The PCBs produced on this new line are integral to equipment used in the manufacturing and testing of semiconductors for AI, data centers, and next-generation communication networks. The advanced production capabilities of this line enable high-precision, high-definition circuit formation, supporting a via pitch of 0.23 mm. The upgrade has also increased production capacity by approximately 1.4 times compared to previous levels and enhanced the plant’s ability to manufacture a wide variety of products in small quantities. OKI Circuit Technology aims to expand its market reach, targeting manufacturers of semiconductor manufacturing and testing equipment.
The semiconductor industry has seen significant advancements, with chips becoming more functional, compact, energy-efficient, and capable of greater data processing. Alongside these developments, there has been progress in miniaturization, multilayering, and the use of new materials to achieve high voltage resistance, large capacity data processing, and high-speed transmission. This has resulted in the need for PCBs with narrower pitch and ultra-high multilayering, exceeding 100 layers, to handle large-volume data processing. To meet these demands, ultra-thin materials and advanced manufacturing technologies, such as ultra-fine hole drilling, are required to accurately penetrate microscopic circuits on multilayer boards.
In response, the Joetsu Plant has expanded its manufacturing area by 3,300 square meters (about 1.2 times its previous size) and added a new surface treatment line for handling ultra-thin materials, as well as additional direct imaging equipment. The automated optical inspection (AOI) equipment has been relocated to optimize the production flow, improving production quality and boosting capacity by about 1.4 times. The new line also offers improved line width accuracy (stabilization of transmission characteristics) through high-precision circuit formation and a high-definition etching line. This is made possible by enhanced automatic transport and direct imaging equipment for materials ranging from ultra-thin 0.03 mm to thick 8 mm boards. President Masaya Suzuki noted that the installation of additional high-precision drilling equipment has enhanced OKI Circuit Technology’s ultra-fine hole drilling capabilities (for diameters of 0.10 mm or less), enabling the production of ultra-high multilayer and high-definition PCBs with over 110 layers, catering to the demands of next-generation semiconductor manufacturing and testing.
OKI is currently focusing on its EMS business, which offers comprehensive one-stop Mono-zukuri services, including design, manufacturing, and reliability testing. The installation of this new PCB production line is part of OKI’s broader investment in technological development and production ramp-up in high-growth areas within the PCB business, such as semiconductors, aerospace, defense, robotics, and next-generation communications. OKI is committed to ongoing development in PCB and manufacturing technologies in line with advancements in related industries.
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Terminology:
- Via Pitch: The distance between via holes that electrically connect conductors; smaller distances present greater manufacturing challenges.
- AOI (Automated Optical Inspection): Automated visual inspection used in PCB and LCD panel manufacturing, employing cameras to scan components for missing parts, fillet size and shape, and distortions.
