Nordson Test & Inspection to Showcase Cutting-Edge Inspection and Metrology Innovations at IPC APEX Expo 2025
Nordson Test & Inspection has announced its plans to introduce groundbreaking inspection and metrology technology at the upcoming IPC APEX Expo, set to take place from March 18-20, 2025, in Anaheim, California. Attendees visiting booth #3200 will have the opportunity to witness live demonstrations of the company’s state-of-the-art Optical, X-Ray, and Acoustic Inspection and Metrology systems. In addition, Nordson will be unveiling the latest advancements within its comprehensive Nordson Intelligence ecosystem, designed to enhance efficiency, precision, and quality in manufacturing processes.
Advancing Artificial Intelligence, Machine Learning, and Deep Learning
As an industry leader in innovative inspection and metrology solutions, Nordson Test & Inspection continues to push the boundaries of technology by integrating Machine Learning (ML), Deep Learning (DL), and Artificial Intelligence (AI) into its Nordson Intelligence ecosystem. The latest breakthrough in this ecosystem is Nordson Sight, a fully integrated SPC (Statistical Process Control) solution that delivers complete machine-level to factory-wide SPC capabilities.
Nordson Sight is designed to provide manufacturers with in-depth historical analysis, robust reporting tools, and full traceability to enable effective process verification and control. This technology ensures that companies can monitor manufacturing performance in real-time through yield analysis charts, defect analysis tools, and intuitive diagnostics that streamline corrective actions. By leveraging Nordson Sight, manufacturers can optimize efficiency, enhance product quality, and drive continuous improvement in their processes.
Next-Generation AOI, SPI, and CMM Solutions
Nordson will be presenting its SQ7000™+ Multi-Function system, an advanced solution engineered to support a wide range of next-generation applications. This highly versatile system is capable of delivering Automatic Optical Inspection (AOI), Solder Paste Inspection (SPI), and Coordinate Measurement Machine (CMM) functionalities, making it an all-in-one powerhouse for inspection and metrology.
The SQ7000+ is specifically designed to address the increasing complexity of modern manufacturing, including applications such as advanced packaging, advanced Surface Mount Technology (SMT), socket metrology, memory module inspection, mini/microLED assessments, and ultra-small solder paste inspection for 008004/0201 components. The system features an upgraded Multi-Reflection Suppression® (MRS®) sensor, which eliminates reflection-based distortions common in shiny components and specular surfaces.
This high-resolution sensor, combined with an advanced coordinate measurement software suite, enables manufacturers to inspect for defects with exceptional precision and measure critical parameters that impact quality. With its high-speed inspection capabilities, the SQ7000+ helps improve yields, reduce defects, and streamline the manufacturing workflow.
Introducing the SQ3000™M2 for Micro-Electronics Inspection
Another highlight at the Nordson Test & Inspection booth will be the newly launched SQ3000™M2 Inspection and Metrology system, a cutting-edge solution designed for micro-electronics applications. The SQ3000™M2 leverages Focus Variation Metrology (FVM) technology and high-resolution telecentric optics to deliver unparalleled accuracy and resolution in defect detection and measurement.
Equipped with advanced sensors that provide both 2D and 3D height measurements, this system is optimized for high-resolution inspections across various packaging applications, including wire bond loop height measurements and other precision metrology tasks. Manufacturers working in micro-electronics, semiconductor packaging, and miniaturized component assembly will greatly benefit from the system’s superior defect coverage and advanced metrology capabilities.
Revolutionizing Automated X-Ray Inspection with Dynamic Planar CT™
Nordson will also introduce Dynamic Planar CT™, the next generation of 3D Planar X-Ray inspection software designed for Automated X-Ray Inspection (AXI) systems. This innovative technology is engineered to provide unmatched detail, significantly improved data quality, and superior layer separation using advanced 3D reconstruction algorithms.
With a larger field of view and an accelerated image acquisition process that is twice as fast as traditional Planar CT technology, Dynamic Planar CT™ enhances the efficiency of X-ray inspections while delivering clearer, more accurate results. This breakthrough is particularly beneficial for manufacturers seeking high-resolution imaging to detect hidden defects in complex assemblies, electronic components, and multi-layer PCBs.
Quadra® 7 Pro MXI: Setting New Standards in 3D/2D Manual X-Ray Inspection
For manufacturers requiring 3D and 2D manual X-Ray inspection, Nordson’s Quadra® 7 Pro MXI system is redefining industry standards. Designed for both back-end semiconductor and SMT applications, the system integrates Onyx® detector technology, which ensures exceptional image clarity with ultra-low noise levels.
What sets the Quadra® 7 Pro apart is its Dual Mode Quadra NT4® X-ray tube, which offers unprecedented flexibility by allowing operators to seamlessly switch between brightness and resolution modes depending on specific application requirements. Additionally, the system is powered by Revolution™ software, a highly intuitive platform that enhances user experience with expanded functionality, making defect detection faster and more efficient.
Advanced Acoustic Micro-Imaging Inspection (AMI) with the D9650™
In the field of Acoustic Micro-Imaging Inspection (AMI), Nordson’s D9650™ system, powered by C-SAM® technology, is setting new benchmarks in failure analysis, process development, and material characterization. Designed for high-precision back-end semiconductor and SMT applications, the D9650™ offers unparalleled accuracy and maximum flexibility for manufacturers seeking advanced non-destructive testing (NDT) solutions.
The D9650™ is ideal for inspecting delicate microelectronics, including die attach, voiding analysis, and delamination detection. By utilizing ultra-high-frequency transducers and real-time imaging software, this system delivers crystal-clear acoustic images, making it an indispensable tool for R&D labs, failure analysis centers, and process optimization teams.
Live Demonstrations at IPC APEX Expo 2025
Visitors to the Nordson Test & Inspection booth (#3200) at IPC APEX Expo 2025 will have the unique opportunity to see these advanced inspection and metrology solutions in action. Attendees can experience firsthand how Nordson’s technologies can improve manufacturing yields, optimize process efficiency, and elevate overall productivity.
Nordson’s team of experts will be available to discuss specific application challenges, provide technical insights, and demonstrate the full capabilities of their latest innovations. Whether you’re involved in PCB assembly, semiconductor manufacturing, microelectronics, or high-precision industrial applications, Nordson Test & Inspection offers a comprehensive suite of solutions designed to meet the most demanding quality control and metrology requirements.
