Nitto Denko and IBM Announce Joint Development Agreement for Advanced Packaging Materials Research
Nitto Denko Corporation a leading global materials science company, today announced that it has entered into a joint development agreement with IBM to collaborate on cutting-edge semiconductor packaging technology and materials research. The agreement marks a strategic partnership between Nitto and IBM, bringing together expertise in materials science and semiconductor innovation to tackle the evolving challenges of advanced packaging processes. Through this collaboration, researchers from both organizations will explore and evaluate potential applications for new classes of polymeric materials specifically designed for next-generation semiconductor packaging technologies.
The semiconductor industry is currently witnessing rapid growth in advanced packaging solutions, particularly driven by the increasing demand for AI computing and next-generation chiplet designs. Advanced packages require higher wiring density for redistribution layers (RDLs), larger package sizes, and enhanced performance under thermal and mechanical stress. However, these developments also introduce significant technical challenges, including package warpage, thermal expansion, and reliability concerns in large-scale and high-density packaging configurations. Nitto and IBM’s joint research aims to address these challenges by developing new materials and solutions that can enhance the thermo-mechanical performance and reliability of semiconductor packages while meeting the rigorous demands of modern AI applications.
“Nitto is pleased to collaborate with IBM Research to advance materials research aimed at next-generation RDL technologies,” said Yosuke Miki, Nitto’s Director, Senior Executive Vice President, CTO, and General Manager of the Corporate Technology Sector. “Materials innovation has historically played a pivotal role in the evolution of semiconductor devices and packaging technologies. With the rising complexity of advanced packages, it is critical to develop materials that can support higher performance and reliability. Through this collaboration, we aim to accelerate the development of innovative materials that will underpin the next generation of semiconductor packaging, particularly in the AI era.”
Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations at IBM Research, added, “We are excited to collaborate with Nitto to further materials research for advanced semiconductor packaging. IBM has long been a pioneer in the development of chiplet technology and advanced packaging solutions for AI applications. By combining our semiconductor packaging expertise with Nitto’s extensive experience in polymeric and advanced materials development, we anticipate achieving breakthroughs that can significantly enhance the performance and reliability of future AI semiconductor packages.”
The joint development program between Nitto and IBM covers a broad spectrum of research areas. In addition to polymeric materials, the partnership will explore the application of Nitto’s proprietary advanced packaging materials to improve the performance and durability of semiconductor packages. Key focus areas include reducing thermal expansion and warpage of package substrates, improving mechanical stability under high-density wiring conditions, and minimizing crosstalk noise in fine-pitch interconnections. These efforts are expected to contribute to the overall advancement of semiconductor packaging technologies, providing solutions to the increasingly complex demands of AI and high-performance computing systems.
By combining IBM’s semiconductor packaging and chiplet expertise with Nitto’s deep knowledge of materials science, the collaboration aims to push the boundaries of what is possible in the semiconductor industry. The partnership highlights the critical role of material innovation in enabling next-generation semiconductor technologies and reflects a shared commitment to addressing key technical challenges that impact the performance, reliability, and scalability of advanced packages.
This initiative comes at a time when the semiconductor industry is placing greater emphasis on integrating diverse materials and innovative packaging solutions to meet growing AI computing needs. As advanced packages become more complex, ensuring thermo-mechanical reliability, minimizing signal interference, and reducing structural stress in semiconductor devices has become more crucial than ever. Through this joint development program, Nitto and IBM are poised to deliver research outcomes that could shape the future of semiconductor packaging, supporting the broader industry in achieving higher efficiency, improved performance, and enhanced reliability for next-generation AI applications.
The collaboration between Nitto Denko and IBM represents a strategic step toward addressing the technological demands of the AI-driven semiconductor era. By fostering joint research and development in advanced materials, the partnership aims to create innovative solutions that not only overcome current packaging challenges but also anticipate the requirements of future semiconductor devices and applications.
