Mixx Technologies Unveils Groundbreaking Advanced 3DS Platform to Revolutionize AI Infrastructure
Mixx Technologies, Inc., a leader in the development of next-generation optical interconnect solutions, has unveiled its innovative Advanced 3DS Platform, setting a new standard for AI and high-performance computing (HPC) infrastructure. Designed to meet the demands of AI workloads, the platform features a powerful Engine that integrates compute, memory, and networking capabilities to provide exceptional performance.
This unique package includes Mixx Technologies’ Engine, paired with core ASICs to create ultra-fast super XPUs with lightning-speed connectivity. The system offers exaflop-scale computing with petabit-end-to-end connectivity, transforming rack-scale computing into the future of AI and HPC infrastructure. The company will showcase this breakthrough technology at the OFC 2025 Conference from April 1-3, 2025, at the Moscone Center in San Francisco, at both the Corning booth (#1643) and the US Conec booth (#1443).
Addressing the Growing Demand for AI Infrastructure
As AI continues to evolve, traditional interconnects are struggling to keep pace with the growing demands of AI workloads. With AI infrastructure investments booming, Gartner forecasts that global spending on data center systems will surge by 23.2% in 2025, reaching $405 billion. Additionally, the Dell’Oro Group predicts that worldwide data center spending will exceed $1 trillion by 2029. As a result, the interconnect bottleneck challenges that enterprises face are expected to intensify. To address this, Mixx Technologies is leveraging silicon-integrated optics to revolutionize the data movement landscape, offering energy-efficient, non-blocking solutions that ensure future-proof infrastructure for AI workloads.
Mixx Technologies’ Advanced 3DS Platform is purpose-built to provide intelligent orchestration with flexible resource allocation, real-time inference, and large-scale AI training via multi-petabit interfaces. With ultra-low latency and high throughput, the optical interconnects seamlessly integrate with advanced ASICs, reducing network complexity and ensuring continuous operation for dynamic AI workloads. These groundbreaking features solve the critical infrastructure bottlenecks of today while being engineered to scale with tomorrow’s technological advancements, positioning the platform as a catalyst for AI and HPC innovation.
Vision for the Future of AI Interconnects
“We are energizing the future of technology, laying the foundation for the AI-driven world of tomorrow,” said Vivek Raghuraman, Co-Founder and CEO of Mixx Technologies. “Our mission is to enable cost-effective scaling, delivering higher performance per dollar per watt for sustainable compute connectivity. Our goal is not simply to develop another product but to fundamentally rethink AI interconnects. Our Advanced 3DS Platform unlocks unprecedented performance, ensuring that AI workloads can scale beyond the limitations of today’s architecture.”
Key Features of Mixx Technologies’ Advanced 3DS Platform
Mixx’d Intelligence: The platform enables intelligent orchestration with flexible resource allocation, allowing users to deploy computing power where it’s needed, when it’s needed.
Unmatched Speed: With multi-petabit interfaces offering low latency and high throughput, the platform accelerates real-time inference and large-scale AI training, driving next-generation AI performance.
Engineered for Reliability: By siliconizing optical interconnects, the platform integrates seamlessly with advanced ASICs. This approach ensures reliability, reduces network complexity, and guarantees continuous operation for dynamic, real-time AI workloads.
Future-Proof Innovation: Mixx Technologies has built the Advanced 3DS Platform to stay ahead of the curve, ensuring that it remains compatible with future technological advancements. The platform’s standards-compliant solutions are designed to evolve with the rapidly changing demands of AI and HPC industries.
Expertise Driving the Evolution of AI Infrastructure
With decades of experience in silicon photonics, networking, and system architecture, Mixx Technologies brings unparalleled expertise to the AI and HPC sectors. The company was founded by industry veterans Vivek Raghuraman and Rebecca K. Schaevitz, who have previously played key roles in developing and scaling next-generation interconnects. Prior to founding Mixx Technologies, they contributed to the successful deployment of multiple products at major companies such as Broadcom, Intel, and Corning.
Mixx Technologies has also established a broad partner ecosystem that includes leading semiconductor companies, hyperscalers, and tier-1 suppliers. This ecosystem fosters collaboration to qualify and drive the adoption of cutting-edge AI interconnect solutions, further solidifying the company’s leadership position in the field.
Educational Insights at OFC 2025
In addition to showcasing its Advanced 3DS Platform at OFC 2025, Vivek Raghuraman, CEO of Mixx Technologies, will present a special session titled “The Paradigm Shift: Bringing Optics to AI” on Wednesday, April 2 at 2 p.m. PT. This presentation will take place during the “Advanced Packaging and Integrated Optics for Scale-Up AI Interconnects” symposium. Raghuraman’s talk will explore how scaling AI requires high-density interconnects that can handle D2D interface bandwidth, why current packaging architecture is unsustainable, and how silicon photonics enables scalable interconnects while maintaining consistent packaging for long-term reliability.
Raghuraman’s insights will shed light on the vital role that optics play in the AI ecosystem and how the Advanced 3DS Platform is at the forefront of this paradigm shift. More information about this session can be found on the OFC 2025 website.
Mixx Technologies is at the cutting edge of AI and HPC infrastructure, providing solutions that enable enterprises to stay ahead in the race for AI innovation. The launch of its Advanced 3DS Platform marks a significant milestone in the evolution of interconnect technologies, offering AI-driven businesses a reliable, scalable, and high-performance solution to meet their growing demands. As AI workloads continue to grow in complexity and scale, Mixx Technologies’ platform ensures that infrastructure remains future-proof, providing a solid foundation for the next generation of AI and HPC applications.
