Mitsubishi Electric to Launch Compact DIPIPM Power Semiconductor Module Samples for Consumer and Industrial Applications
Mitsubishi Electric Corporation has announced the development of a new generation of compact power semiconductor modules designed to meet the evolving needs of both consumer and industrial equipment manufacturers. The new Compact DIPIPM series targets applications such as packaged air conditioners and heat pump systems for heating and hot water, where compactness, efficiency, and reliability are critical.
The series will initially feature two models: the PSS30SF1F6 with a rated current of 30A and rated voltage of 600V, and the PSS50SF1F6 with a rated current of 50A and rated voltage of 600V. Mitsubishi Electric confirmed that samples of these modules will begin shipping on September 22, 2025.
Smaller Footprint, Bigger Impact
The standout feature of this new series is its size reduction. By incorporating reverse-conducting insulated-gate bipolar transistors (RC-IGBTs), Mitsubishi Electric has managed to shrink the footprint of the Compact DIPIPM modules to just 53% of the company’s existing Mini DIPIPM Ver.7 series. This dramatic reduction enables manufacturers to design smaller, more space-efficient inverter substrates, which are essential for applications like packaged air conditioners, where component size directly impacts the overall product dimensions and flexibility of installation.
The company will officially showcase these new modules at the upcoming Power Conversion and Intelligent Motion (PCIM) Asia Shanghai 2025, which runs from September 24 to 26 in China. Industry professionals attending the exhibition will have the first opportunity to examine the modules and understand their technical advantages.
Growing Demand for Power Semiconductors
Power semiconductors are indispensable for converting electricity efficiently from direct current (DC) to alternating current (AC). With global energy consumption patterns shifting, demand for these components has surged. In particular, power semiconductor modules used in packaged air conditioners and heat pump heating systems are crucial for managing power conversion in inverter systems that control compressors and fans.
The adoption of inverter technology in air conditioning systems is accelerating worldwide, driven by the urgent need to cut energy consumption and support the transition to a low-carbon economy. In this context, there is an increasing emphasis not only on performance but also on compactness. Smaller outdoor units and more space-efficient heat pump systems allow for easier installation, lower material usage, and reduced carbon footprint in manufacturing. This trend has created a clear demand for more compact components such as inverter substrates, directly aligning with Mitsubishi Electric’s innovation.
Mitsubishi Electric’s Legacy of Innovation
Mitsubishi Electric has a long history in the development of power semiconductor modules. In 1997, the company introduced the DIPIPM intelligent power module with a transfer mold structure. This breakthrough innovation integrated both the switching elements and control ICs that drive and protect them. Over the years, DIPIPM modules have found wide application across industries – from air conditioners and washing machines to heating systems and industrial motors.
These products have consistently enabled manufacturers to design smaller, more efficient inverters, while also improving overall energy efficiency. The new Compact DIPIPM series continues this tradition by offering a 47% smaller footprint compared to conventional designs, without compromising reliability or functionality.
Enhanced Features and Cold-Climate Reliability
The new modules integrate several features aimed at addressing industry challenges. The adoption of RC-IGBTs is not just about size reduction; it also enhances module performance and supports compact inverter substrate design. Moreover, Mitsubishi Electric has introduced a new interlock function for arm short-circuit protection, which simplifies overall design requirements for engineers.
Another notable feature is the module’s insulation design. The distance between terminals and the heat sink remains consistent with conventional products, making it easy for manufacturers to replace or upgrade existing systems without costly redesigns.
Importantly, Mitsubishi Electric has engineered these modules to withstand harsh environmental conditions. With a continuous operating temperature lower limit of -40°C, the modules can function reliably in cold regions such as Northern Europe and North America, where demand for heat pump air conditioning systems is growing. This ensures stable operation even in challenging climates, helping accelerate the adoption of inverter-equipped systems across diverse global markets.
Supporting Global Sustainability Goals
By enabling smaller, more efficient inverter designs, Mitsubishi Electric’s Compact DIPIPM series plays a role in the global movement toward carbon neutrality. As more households and industries adopt heat pump systems and energy-saving air conditioners, the demand for compact, efficient power conversion modules will only increase. These new products directly contribute to reducing greenhouse gas emissions by enabling devices that consume less electricity while delivering strong performance.
