MIPI Standards Highlighted at embedded world Conference for Embedded and Automotive Implementations

MIPI Alliance, a global organization dedicated to developing interface specifications for mobile and related industries, has announced that the upcoming 22nd embedded world Exhibition & Conference, set to take place from April 9-11 in Nuremberg, Germany, will feature a series of presentations highlighting MIPI specifications. These presentations will cover various aspects, including MIPI camera and display specifications, MIPI’s role in automotive applications, and the MIPI I3C utility and control bus.

The event will encompass the entire spectrum of embedded systems development and application, from foundational technologies to specialized fields. MIPI Alliance will serve as a Community Partner for the conference, offering its members a 10% discount on registration using the code “EWC24MIPI”.

Key Details:

  • Event: Embedded World Exhibition & Conference
  • Date: April 9-11, 2024
  • Location: Nuremberg, Germany
  • Target Audience: Engineers and technical managers involved in the development and deployment of embedded systems.

MIPI Conference Tracks:

The conference will feature nine MIPI-powered presentations across three Board Level Hardware Engineering tracks, focusing on MIPI I3C, MIPI Camera Serial Interface 2 (CSI-2), MIPI Display Serial Interface (DSI), and MIPI A-PHY. Additionally, three more MIPI member presentations will be integrated into other sessions throughout the event.

  • MIPI I3C Track:
    • Session 5.4 Board Level Hardware Engineering (April 10 | 11:00-12:45)
      • Topics include the next-generation utility and control bus MIPI I3C, protocol demystification, and real-world implementations.
  • MIPI Track:
    • Session 5.5 Board Level Hardware Engineering (April 10 | 13:45-15:30)
      • Presentations delve into challenges and solutions for high-resolution camera sensors, in-depth exploration of MIPI DSI/CSI-2/D-PHY, and machine vision applications in industrial settings.
  • Automotive Design Track:
    • Session 5.10 Board Level Hardware Engineering (April 11 | 09:30-11:15)
      • Topics cover MIPI A-PHY camera integration, connectivity challenges in automotive environments, and the role of MIPI A-PHY v2.0 in supporting software-defined vehicles and centralized automotive architectures.

In addition to these sessions, several more MIPI member presentations will address topics such as connectivity innovations in machine vision, radar processing centralization, and microcontroller pin count reduction through I3C interface utilization.

For detailed session descriptions and the full conference agenda, visit the MIPI Events page or the embedded world Conference Program.

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