Keysight has unveiled the Electrical Structural Tester (EST), a groundbreaking wire bond inspection solution designed for semiconductor manufacturing to ensure the reliability and integrity of electronic components. As the semiconductor industry grapples with testing challenges due to the increasing density of chips used in mission-critical applications like medical devices and automotive systems, traditional testing methods often fall short. These methods frequently miss structural defects in wire bonds, leading to costly latent failures, and rely on sampling techniques that may not capture all potential issues.
The EST tackles these challenges with its advanced nano Vectorless Test Enhanced Performance (nVTEP) technology, which creates a capacitive structure between the wire bond and a sensor plate. This technology allows the EST to detect subtle defects such as wire sag, near shorts, and stray wires, providing a thorough assessment of wire bond integrity.
Key features of the EST include:
- Advanced Defect Detection: Identifies a broad spectrum of wire bond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns, ensuring the functionality and reliability of electronic components.
- High-Volume Manufacturing Capability: Supports testing of up to 72,000 units per hour by evaluating up to 20 integrated circuits simultaneously, enhancing productivity and efficiency in high-volume production settings.
- Big Data Analytics Integration: Utilizes advanced methods such as Marginal Retry Test (MaRT), Dynamic Part Averaging Test (DPAT), and Real-Time Part Averaging Test (RPAT) to capture defects and improve yield.
Carol Leh, Vice President of the Electronic Industrial Solutions Group Center of Excellence at Keysight, commented, “Keysight is committed to developing innovative solutions that tackle the critical challenges in the wire bonding process. The Electrical Structural Tester enables chip manufacturers to boost production efficiency by quickly identifying wire bond defects, thereby ensuring high quality and reliability in high-volume manufacturing.”
The Electrical Structural Tester will be featured at the Keysight booth (K3283) during SEMICON Taiwan 2024, taking place at the Taipei Nangang Exhibition Center Hall 1 from September 4-6, 2024.
