CPC Launches New High-Flow Connector Solution to Meet Accelerating AI Liquid Cooling Demands
CPC (Colder Products Company), a Dover Corporation business and a recognized global leader in fluid handling and connection technologies, has unveiled its latest innovation aimed at solving one of the most pressing challenges in modern computing: the need for advanced liquid cooling in artificial intelligence (AI) environments. The newly introduced Everis® UQD06 Series connectors are engineered to handle the increasingly demanding thermal management requirements of hyperscale AI, high-performance computing (HPC), and large-scale data center operations.
As AI applications continue to scale rapidly, with ever-larger models and more powerful hardware, the volume of heat generated by processors and GPUs is becoming a critical bottleneck. Traditional air cooling methods are no longer sufficient for these compute-intensive workloads. Liquid cooling has become the solution of choice for managing these thermal loads effectively while also maintaining efficiency and reliability.
Engineered for the Future of AI Workloads
The Everis UQD06 Series is the latest addition to CPC’s Universal Quick Disconnect (UQD) platform, designed specifically to meet the high-flow demands of AI-driven systems. Featuring a 3/8-inch flow path, the UQD06 fills a crucial performance gap in the UQD lineup, which already includes 1/8-inch and 1/4-inch variants. By expanding the flow path, the UQD06 allows for greater coolant throughput, improving heat transfer without forcing operators to increase pump power — a critical consideration for energy-efficient system design.
“The substantial heat generated by AI workloads requires new ways to optimize flow in liquid cooling systems,” said Patrick Gerst, General Manager of CPC’s thermal business unit. “With the UQD06 Series, CPC is building on our long track record of delivering much-needed solutions for efficient cooling. We remain focused on supporting AI’s expansion and unique liquid cooling specifications through innovation at scale.”
Gerst emphasized that while increasing coolant flow rates is one method to improve thermal performance, it’s not always ideal. Higher flow rates can demand significantly more pumping power, which affects not only the system architecture but also power consumption — a growing concern in energy-conscious data centers.
“Increasing the connector’s flow path size is one way to add flow capacity,” he explained. “It enables optimized cooling performance without requiring dramatic changes to pump design or energy use, which is a win for system designers and sustainability goals alike.”
Market Trends Reflect Rising Adoption of Liquid Cooling
The broader market is clearly moving toward liquid cooling technologies as computing needs grow more complex. According to research from Hyperion Research, nearly two-thirds of high-performance computing (HPC) and AI installations already incorporate some form of liquid cooling, and that number is expected to climb to almost 80% within the next 12 to 18 months.
This trend highlights the need for flexible, reliable, and high-performing connection solutions that can be seamlessly integrated into a range of cooling architectures. CPC’s Everis UQD Series is already widely regarded for its superior build quality, ease of use, and patented sealing technologies that minimize leaks and reduce system downtime. The new UQD06 continues that tradition with extensive testing and robust engineering to handle the rigors of high-throughput cooling loops.
“As a trusted technology partner to leading chip manufacturers and cooling integrators, we provide solutions that help protect mission-critical applications, particularly as AI continues to scale rapidly,” said Michael Studer, Vice President of the CPC business unit. “The UQD06 gives our partners another powerful tool to push system performance without compromising on reliability or efficiency.”
A Legacy of Connection Innovation
CPC has built its reputation over nearly five decades by developing industry-leading quick disconnect couplings, fittings, and connectors. Its expansive catalog of over 10,000 products serves diverse markets including life sciences, biopharma, industrial processing, and electronics cooling. The company is a vital player in thermal management systems where high flow, reliability, and clean disconnection are essential.
Operating as a business unit of PSG (Pump Solutions Group), part of Dover Corporation, CPC continues to evolve with market demands, staying at the forefront of innovation in fluid handling and system connectivity. The company’s emphasis on high-performance, easily integrated components has made it a go-to partner in both emerging and established technology sectors.
With the AI and HPC landscapes evolving at an unprecedented pace, CPC’s focus on modularity, scalability, and system optimization puts it in a strong position to support the next generation of computing infrastructure.
About CPC (Colder Products Company):
CPC is a global leader in the design and manufacture of quick disconnect couplings, fittings, and connectors used across a wide range of industries, including thermal management for electronics, life sciences, biopharma, and industrial chemical handling. With a product catalog of over 10,000 innovative connection solutions, CPC focuses on delivering precision, quality, and reliability. CPC is part of PSG (Pump Solutions Group), a division of Dover Corporation, a diversified global manufacturer and solutions provider.
