Laser Photonics Corporation, a global leader in industrial laser systems for material processing and cleaning, has announced a groundbreaking research and development initiative aimed at advancing laser solutions for several critical industries. This initiative focuses on pharmaceutical tablet drilling, wafer scribing, and semiconductor marking, signaling LPC’s commitment to innovation and market diversification.
The announcement comes on the heels of LPC’s strategic acquisition of Control Micro Systems, Inc. (CMS). By integrating CMS’s cutting-edge technologies and expertise, LPC is channeling significant resources into engineering projects designed to enhance and expand its portfolio of laser systems. This move solidifies LPC’s position as a key player in industrial laser applications while broadening its reach into new markets.
Laser technology has transformed material processing across various sectors,” stated Wayne Tupuola, CEO of LPC. “With the acquisition of Control Micro Systems, we’re unlocking new opportunities to serve even more industries. The advanced technologies and skilled development team from CMS have already become vital to our progress.
Expanding into New Markets
LPC’s new R&D initiative targets three key sectors: pharmaceuticals, wafers, and semiconductors. These industries present significant opportunities for laser applications, and LPC aims to maintain a competitive edge by advancing its existing technologies to meet evolving market demands.
Pharmaceutical Applications
In the pharmaceutical industry, LPC plans to refine the tablet drilling and marking system developed by CMS. This automated Class I CO2 laser system is specifically designed for time-release medications, offering features like custom tablet fixtures, fume extraction, and machine vision inspection. These capabilities ensure precise drilling, anti-counterfeiting measures, and stringent quality control. By improving this system, LPC aims to address the increasing demand for high-precision solutions in pharmaceutical manufacturing.
Wafer Processing
For wafer serialization, LPC is enhancing a multi-station system originally developed by CMS. This technology is optimized for marking, scribing, and lapping wafers made of silicon and related compounds. Supporting wafers up to 300 mm wide and 300–800 microns thick, the system incorporates robotic wafer positioning for seamless operation. Its applications span consumer electronics, solar panels, LEDs, MEMS devices, and optoelectronic components. LPC’s advancements will ensure greater efficiency and accuracy in wafer production and tracking.
Semiconductor Innovations
LPC is also focusing on improving CMS’s semiconductor laser marking system, a solution that features a high-precision ultraviolet laser and a galvanometer scan head. Designed for creating small, permanent markings on IC mold compounds and ceramics, this system minimizes heat impact, ensuring the integrity of the components. Additionally, machine vision capabilities allow for precise chip positioning and marking alignment. LPC’s efforts will further enhance this system’s speed and precision, meeting the stringent requirements of the semiconductor industry.
Looking Ahead
This R&D initiative underscores LPC’s dedication to driving innovation and delivering advanced solutions to diverse markets. By leveraging CMS’s state-of-the-art technology and expertise, LPC is poised to meet the needs of its customers while remaining at the forefront of industrial laser technology.
Stay tuned for additional announcements, Tupuola hinted. We’ll be sharing more details about each of these advanced systems and the progress we’re making in our mission to redefine laser technology.
With this initiative, Laser Photonics is not only advancing its technological capabilities but also strengthening its role as a leader in the industrial laser sector. The company’s focus on pharmaceuticals, wafer processing, and semiconductors positions it to address the growing demands of these industries with innovative and reliable solutions.
