Amkor Technology has announced a new memorandum of understanding with TSMC aimed at collaborating on advanced packaging and testing capabilities in Arizona. This partnership is set to bolster the semiconductor ecosystem in the region.
The two companies have been working closely together to deliver high-volume, cutting-edge technologies for semiconductor packaging and testing, catering to critical sectors like high-performance computing and communications. As part of the agreement, TSMC will utilize Amkor’s turnkey advanced packaging and test services at their upcoming facility in Peoria, Arizona. This collaboration will enable TSMC to better support its customers, particularly those utilizing TSMC’s advanced wafer fabrication facilities in Phoenix. The proximity of TSMC’s front-end fabrication site and Amkor’s back-end facility will help streamline overall product cycle times.
The partnership will focus on specific packaging technologies, including TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®), to meet the shared needs of their customers.
This agreement highlights both companies’ commitment to providing geographic flexibility in front-end and back-end manufacturing, while also contributing to the growth of a vibrant semiconductor manufacturing ecosystem in the United States. Their joint vision aims to ensure seamless technology alignment for customers across a global manufacturing network.
Amkor is proud to collaborate with TSMC to provide integrated silicon manufacturing and packaging processes through an efficient turnkey advanced packaging and testing model in the United States,” said Giel Rutten, Amkor’s President and CEO. “This expanded partnership reflects our dedication to driving innovation in semiconductor technology while maintaining resilient supply chains.
Our customers are increasingly relying on advanced packaging technologies for breakthroughs in mobile applications, artificial intelligence, and high-performance computing. TSMC is excited to partner with our trusted, long-time ally Amkor to support these needs with a more diverse manufacturing footprint,” said Dr. Kevin Zhang, TSMC’s Senior Vice President of Business Development and Global Sales, and Deputy Co-COO. “We look forward to collaborating closely with Amkor at their Peoria facility to maximize the potential of our fabs in Phoenix and provide enhanced services to our customers in the United States.
