Murata Manufacturing announces a new collaboration with Synopsys, Inc., enabling users of Synopsys simulation tools to directly access Murata’s website to view and download Murata’s latest high-performance simulation models. This collaboration encompasses Synopsys’ Ansys HFSS™ 3D electromagnetic field analysis tool and Ansys Icepak® thermal analysis tool, and represents a significant step toward streamlining the simulation workflow for electronic circuit designers. Murata is also the first company to offer passive component simulation models via Ansys Icepak*.
As the demand for high-speed, high-capacity communications continues to grow, the design of electronic circuits has become increasingly complex. Engineers must now consider a range of physical phenomena, from electromagnetic interference (EMI) to heat generation by components, within a single design. Addressing these challenges in the early stages of the design process is crucial; neglecting them can lead to costly modifications, extended development times, and increased prototyping expenses. This has increased the pressure on electronic component suppliers to provide high-quality, ready-to-use simulation models that are compatible with the tools engineers already rely on.
Developing accurate models for electromagnetic and thermal analysis is inherently challenging, as electromagnetic behavior and temperature distribution vary considerably depending on design conditions. Murata’s vertically integrated approach, which spans raw material development and manufacturing through to final product processing, allows the company to leverage a vast proprietary dataset, resulting in simulation models that accurately reflect the actual performance of components.
The models are compatible with Ansys 2026 R1. Ansys HFSS supports electromagnetic field analysis and covers Murata RF inductors and multilayer ceramic capacitors (MLCCs), while Ansys Icepak supports thermal analysis and covers Murata power inductors.
In the future, Murata will continue to deepen its collaboration with Synopsys, expanding its model range to support more advanced and efficient electronic design.
The following data can be downloaded from the Murata website:
Electromagnetic field analysis data for Ansys HFSS — RF inductors
; Electromagnetic field analysis data for Ansys HFSS — MLCC;
Thermal analysis data for Ansys Icepak — Power inductors
For any inquiries regarding product data, please contact Murata here for inductors, or here for capacitors.
Notes:
*Based on studies conducted by Murata as of June 15, 2026.
About Synopsys
Synopsys, Inc. (Nasdaq: SNPS) is the leader in engineering solutions, from silicon to systems, enabling customers to rapidly innovate in AI-driven products. We provide cutting-edge silicon design, intellectual property (IP), simulation and analytics solutions, and design services. We work closely with customers across a wide range of industries to maximize their R&D capabilities and productivity, fueling today’s innovation that drives tomorrow’s ingenuity. Learn more at www.synopsys.com .
© 2026 Synopsys, Inc. All rights reserved. Synopsys, Ansys, the Synopsys and Ansys logos, and other Synopsys trademarks are available at https://www.synopsys.com/company/legal/trademarks-brands.html . Other company or product names may be trademarks of their respective owners.
About Murata
Murata Manufacturing Co., Ltd. is a global leader in the design, manufacture, and sale of ceramic-based passive electronic components and solutions, communication modules, and power supply modules. Murata is committed to developing advanced electronic materials and cutting-edge, high-density, multifunctional modules. The company employs staff and has production facilities worldwide.
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