Showcasing Advanced Power Semiconductor Innovations at APEC 2026
Toshiba America Electronic Components, Inc., a global innovator in semiconductors and storage technologies, is set to showcase its latest advancements at the Applied Power Electronics Conference 2026, highlighting solutions designed to enable more intelligent, efficient, and sustainable electronic systems across a wide range of industries, with a strong focus on improving performance while reducing energy consumption in modern applications
Driving Efficiency in Data Centers and Electric Vehicles
Toshiba’s power semiconductor technologies are playing a crucial role in addressing the growing demands of high-density data centers and electric vehicles, where energy efficiency and thermal performance are critical considerations, and in data centers the company’s solutions help reduce power loss while simplifying thermal management challenges, whereas in electric vehicles they contribute to improved system efficiency and extended driving range, ensuring that next-generation mobility and computing infrastructures operate with greater reliability and sustainability
APEC as a Hub for Industry Collaboration
The Applied Power Electronics Conference is widely recognized as a premier global event for the power electronics industry, bringing together engineers, designers, manufacturers, researchers, and thought leaders to explore the latest developments in energy conversion and power management technologies, and Toshiba’s presence at the event underscores its commitment to advancing innovation while engaging with industry stakeholders to shape the future of power electronics across automotive, industrial, infrastructure, defense, medical, and data center markets
Comprehensive Semiconductor Portfolio Supporting Modern Systems
Toshiba’s semiconductor solutions are integral to the systems that power modern life as well as those being developed for the future, ranging from electric mobility and renewable energy systems to hyperscale data centers and advanced industrial automation platforms, and its extensive product portfolio includes silicon (Si), silicon carbide (SiC), and gallium nitride (GaN) field-effect transistors, insulated gate bipolar transistors, optical and digital isolation devices, motor control solutions, microcontrollers, protection integrated circuits such as eFuses, and a wide array of general-purpose semiconductor components designed to meet diverse application requirements
Enhancing Performance While Maintaining Reliability
Across all its application areas, Toshiba emphasizes the importance of balancing performance with reliability and energy efficiency, ensuring that its semiconductor technologies not only meet the increasing power and performance demands of modern systems but also deliver consistent operation under challenging conditions, and this approach is particularly important in sectors such as automotive electrification and data center infrastructure, where system reliability and energy optimization are essential for long-term success and operational stability
Key Product Innovations Introduced at APEC 2026
At APEC 2026, Toshiba is presenting a range of new products and technology enhancements that demonstrate its commitment to advancing power semiconductor performance and efficiency, including the UMOS™ 11 MOSFETs, which expand the company’s portfolio with devices offered in industry-standard packages that deliver improved switching characteristics and reduced RDS(on) per unit area compared to the previous UMOS™ 10 generation, enabling designers to achieve higher efficiency and better thermal performance in compact system designs
Advanced Thermal Management with TOGT Packaging
Another highlight is the introduction of the top-side cooled TOGT package, which is specifically engineered for thermally demanding applications with high power density requirements, and this innovative packaging approach enables heat dissipation through the top of the device rather than the traditional bottom-side path, reducing thermal stress on printed circuit boards and improving overall system reliability while allowing designers to optimize layout and cooling strategies in high-performance electronic systems
Silicon Carbide Solutions for High-Power Applications
Toshiba is also showcasing its latest silicon carbide power modules, which are designed for high-power industrial and grid-level applications and leverage advanced SiC process technology to deliver superior efficiency and performance compared to traditional silicon-based devices, and the company is further expanding its offerings with 750V and 1200V SiC die and modules targeted at automotive drivetrain inverter applications, providing power-dense configurations that can be tailored to specific system requirements and contribute to improved vehicle efficiency and performance
Continued Development of GaN Technologies
In addition to silicon and silicon carbide solutions, Toshiba continues to advance its gallium nitride technology portfolio, focusing on both low-voltage and high-voltage GaN devices that offer significant advantages in terms of switching speed, efficiency, and compact design, and the company has indicated that further product updates in this area are expected later in the year, reflecting ongoing investment in next-generation semiconductor materials that support increasingly demanding power electronics applications
Microcontrollers and Smart Motor Control Solutions
Toshiba’s display at APEC also includes its microcontroller, motor control driver, and SmartMCD™ devices, which are designed to support a wide range of applications including automotive body electronics, electronic control units, and industrial automation systems, and these solutions provide the intelligence and control necessary to optimize system performance while enabling advanced functionality in areas such as motor control, system monitoring, and real-time processing
Demonstrating Real-World Applications Through Reference Designs
To illustrate the practical benefits of its technologies, Toshiba is presenting a series of system reference designs that demonstrate high-efficiency power supply platforms and control architectures, including 3kW server power supply units for data center applications, automotive ECU power designs, and motor control systems for pumps and power tools, and these demonstrations provide valuable insights into how Toshiba’s semiconductor solutions can be applied in real-world scenarios to achieve improved efficiency, reliability, and performance
Strengthening Supply Reliability Through Vertical Integration
A key differentiator for Toshiba is its vertically integrated manufacturing model, which allows the company to maintain control over its production processes while ensuring consistent quality and supply reliability, and combined with a globally diversified supply chain, this approach enables Toshiba to deliver scalable and cost-effective solutions that meet the needs of customers operating in demanding industries, particularly in areas such as automotive electrification and data center infrastructure where long-term supply stability is critical
Engaging with Industry at APEC 2026
Attendees of the Applied Power Electronics Conference are invited to visit Toshiba at booth #1753, taking place from March 23 to March 25 at the Henry B. Gonzalez Convention Center, where they can explore the company’s latest innovations, interact with technical experts, and gain a deeper understanding of how Toshiba’s semiconductor technologies are enabling the next generation of power electronics systems across multiple industries
Overview of Toshiba America Electronic Components
Toshiba America Electronic Components, Inc. serves as the North American semiconductor and storage division of Toshiba, offering a comprehensive portfolio of discrete and integrated devices designed for applications in automotive, data centers, industrial systems, and infrastructure, including silicon, silicon carbide, and gallium nitride power devices, microcontrollers, motor control solutions, isolation and protection integrated circuits, and storage products that address the evolving needs of modern electronic systems
Commitment to Innovation and Customer Support
Established in 1989, Toshiba America Electronic Components has built a strong reputation for delivering reliable and high-performance technologies supported by Toshiba’s global manufacturing network, and the company provides extensive sales, marketing, and technical support services to customers across North and Latin America, ensuring that businesses have access to the expertise and resources needed to successfully implement advanced semiconductor solutions in their products and systems
Enabling the Future of Power Electronics
Through its participation in APEC 2026 and its continued investment in advanced semiconductor technologies, Toshiba is reinforcing its role as a key enabler of innovation in the power electronics industry, providing the tools and solutions necessary to support the development of more efficient, reliable, and sustainable systems that will define the future of energy conversion, mobility, and digital infrastructure worldwide
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