Mitsubishi Electric Expands Its HVIGBT Portfolio with Two Advanced XB Series Modules, Enhancing Reliability, Efficiency, and Environmental Durability for Large-Scale Industrial Inverters
Mitsubishi Electric Corporation has announced a major expansion of its high-voltage power semiconductor lineup with the introduction of two new insulated-gate bipolar transistor (IGBT) modules that will officially launch on December 9. These additions to the company’s 4.5kV/1,200A XB Series are available in two isolation categories—standard isolation at 6.0 kVrms and high isolation at 10.2 kVrms—enabling users across the industrial and transportation markets to select the level of electrical insulation most suitable for their application needs. With this launch, Mitsubishi Electric aims to strengthen the performance, safety, and long-term reliability of inverters built for demanding, high-capacity environments.
These new modules have been engineered specifically for large industrial equipment, particularly for systems that face highly varied operating conditions such as outdoor environments. Applications include railway traction systems, large industrial motor drives, wind and solar power conversion systems, and other heavy-duty power electronics platforms that require stable switching performance under high voltages and currents. Mitsubishi Electric notes that these modules significantly boost both durability and efficiency, representing an important evolution in the company’s already well-established HVIGBT technologies.
To showcase the new solutions, Mitsubishi Electric will display the modules at the 40th Nepcon Japan R&D and Manufacturing show, which takes place in Tokyo from January 21 to 23, 2026. The company also plans to highlight the modules at several major electronics and power-technology exhibitions across North America, Europe, China, India, and additional global venues, emphasizing the importance of these modules for international power electronics markets.
A Technological Leap: RFC Diode and CSTBT Structures at the Core
A major contributor to the elevated performance of the new XB Series modules is Mitsubishi Electric’s proprietary semiconductor technology. The modules incorporate advanced IGBT elements built with the company’s Relaxed Field of Cathode (RFC) diode as well as its Carrier-Stored Trench-Gate Bipolar Transistor (CSTBT) structure—both of which have long been recognized as key innovations in Mitsubishi Electric’s power semiconductor portfolio.
The RFC diode technology is designed to improve diode recovery performance, reduce power losses, and enhance overall module stability during repetitive high-voltage switching. Meanwhile, the CSTBT structure increases carrier density during conduction, enabling significantly lower conduction loss and improved switching characteristics. Together, these enhancements allow the new modules to deliver high efficiency even at elevated current and voltage levels.
Building on these foundations, Mitsubishi Electric further optimized the new devices using new electric field relaxation structures and advanced surface charge control technologies. These advancements make it possible to reduce the chip termination region by approximately 30%, enabling a more compact design without compromising electrical robustness or safety margins.
High Moisture Resistance: A Critical Advantage for Outdoor and Harsh Environments
Among the standout features of the new modules is their exceptionally high moisture resistance, a factor that is increasingly vital as more power-electronics equipment is installed in uncontrolled or outdoor environments. Mitsubishi Electric reports that the new modules provide approximately 20 times greater moisture resistance than existing HVIGBT products. This is a major improvement that directly contributes to extending the service life and reliability of industrial inverters.
Such moisture resilience is essential for sectors like railway transportation, renewable energy infrastructure, mining equipment, and factory automation systems installed in humid, coastal, or temperature-fluctuating regions. High humidity levels can degrade insulation properties and accelerate corrosion in semiconductor modules, ultimately leading to failures or reduced efficiency. By developing a structure capable of withstanding intense moisture stress, Mitsubishi Electric ensures that these new modules can operate reliably even in conditions where other semiconductor solutions may be prone to failure.
This enhancement aligns with global trends in industrial electrification, where equipment is increasingly required to function in outdoor environments or remote installations where maintenance is infrequent. The ability of the modules to withstand such challenges directly supports operators aiming to maintain maximum uptime and lower lifetime maintenance costs.
Reduced Switching Loss and Improved RRSOA for Higher System Efficiency and Stability
Energy efficiency remains a central priority in power electronics, and Mitsubishi Electric has addressed this with noticeable improvements in switching performance. The company states that the new HVIGBT modules achieve approximately 5% lower total switching loss compared to earlier models in the series. In high-power applications where switching occurs thousands of times per second, even a small percentage reduction can translate into substantial energy savings and thermal-management benefits.
Moreover, the modules feature a significantly improved Reverse-Recovery Safe Operating Area (RRSOA), which measures a device’s durability during diode reverse-recovery conditions. Mitsubishi Electric reports that the new modules exhibit 2.5 times greater RRSOA tolerance than previous XB Series models. This improvement reduces the risk of destructive failures during high-stress switching events, such as short-circuit conditions or voltage spikes, making these modules more resilient in applications where stability and fault tolerance are essential.
Enhanced RRSOA performance not only increases system reliability and operating margins but also allows inverter designers more flexibility in optimizing switching parameters without compromising safety. This opens opportunities for more compact cooling systems, lighter power conversion units, and improved efficiency scores across various industrial configurations.
Addressing Global Sustainability Goals Through More Efficient Power Conversion
The introduction of the new XB Series modules is closely aligned with Mitsubishi Electric’s commitment to supporting carbon neutrality and energy efficiency across all sectors. High-performance power semiconductors play a central role in reducing losses during power conversion, which directly lowers energy consumption and heat generation in high-capacity industrial systems. By delivering significant improvements in efficiency, reliability, and durability, the new modules enable large-scale equipment—such as railcars and heavy industrial machinery—to operate more sustainably over their lifetimes.
As industries worldwide accelerate efforts to cut emissions, the importance of high-efficiency HVIGBT solutions continues to grow. These modules help operators meet regulatory requirements, reduce operational costs, and support electrification initiatives spanning transportation, manufacturing, and renewable energy. Mitsubishi Electric’s latest innovations contribute to building power-electronics infrastructures capable of achieving long-term sustainability objectives while meeting modern performance demands.
Global Market Impact and Industry Outlook
The release of these modules comes at a time when global demand for high-voltage semiconductor devices is expanding rapidly. Electrification trends in the rail, automotive, and heavy-industrial sectors, combined with growing investments in renewable energy, have driven a surge in demand for advanced HVIGBT and power-module technologies. Mitsubishi Electric, already a recognized leader in this market, is positioning these modules to serve next-generation inverters and power-conversion systems worldwide.
The company’s decision to exhibit the new products across multiple international venues, including key markets in Europe, North America, China, and India, underscores the global relevance of the technology. Each of these regions is facing increasing pressure to deploy reliable, energy-efficient, and environmentally resilient power-electronics systems to support industrial modernization and clean-energy transitions.
Given these trends, the newly introduced modules are expected to see substantial adoption across rail transport, high-power drives, renewable-energy inverters, and grid-support applications. Their enhanced isolation, durability, and efficiency give them a strong competitive advantage in scenarios where both safety and performance are mission-critical.
A Significant Step Forward in High-Voltage Power Semiconductor Technology
With the release of its new standard-isolation and high-isolation HVIGBT modules, Mitsubishi Electric is delivering a powerful upgrade to its XB Series lineup. The devices incorporate advanced semiconductor structures, offer extraordinary moisture resistance, reduce switching losses, and improve operational safety margins. These enhancements enable the development of more durable, efficient, and sustainable inverters for large industrial and transportation environments—particularly those exposed to harsh or unpredictable conditions.
As global industries continue pushing toward energy efficiency and carbon neutrality, technologies like these HVIGBT modules will play an essential role in shaping the future of electrified equipment and power systems. Mitsubishi Electric’s latest innovations represent a meaningful contribution to this transition, strengthening the company’s leadership in high-voltage semiconductor technology and helping end users achieve long-term performance and sustainability goals.
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