Nordson Test & Inspection to Showcase Advanced Semiconductor Inspection and Metrology Solutions at SEMICON West 2025
Nordson Test & Inspection has announced its participation in SEMICON West 2025, taking place from October 7–9 at the Phoenix Convention Center in Arizona. Visitors to booth 5745 will gain an exclusive opportunity to explore the latest advancements in semiconductor inspection and metrology technology, including live demonstrations of Nordson’s WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system, and the 4800 Integra Bond Tester.
One of the highlights of Nordson’s exhibition is the U.S. debut of the Auto Centering System™ (ACS), an innovative extension of the wireless WaferSense® sensor portfolio. The ACS captures and analyzes real-time data to optimize semiconductor tool setup and maintenance. Its wafer-shaped design enables it to “see” inside equipment, accurately measuring dimensional offsets in x, y, and z axes to quickly center wafer transfer positions—helping manufacturers reduce setup time and improve precision.
Nordson will also demonstrate the next-generation Auto Gapping Sensor™ (AGS2), designed to accelerate non-contact gap measurements and parallelism adjustments under vacuum. This lighter, more compact sensor enhances tool availability, improves measurement repeatability, and ensures uniformity in wafer handling processes.
In the area of manual inspection, the Quadra 7 Pro MXI system sets a new standard for 3D/2D semiconductor inspection in back-end applications. Featuring Onyx® detector technology, it delivers unparalleled image clarity and precision. The system’s Dual Mode Quadra NT4® tube provides operators with flexible brightness and resolution modes, allowing seamless adaptation to diverse inspection requirements and ensuring high-quality results across a wide range of semiconductor applications.
The Gen7 AMI system, powered by C-SAM technology, provides rapid and highly accurate detection of delamination and voiding, offering sophisticated microscopy ideal for laboratory analysis and specialized high-resolution applications.
Mid-End Semiconductor Solutions
Nordson’s SpinSAM™ Acoustic Micro Imaging Inspection (AMI) system demonstrates industry-leading throughput and sensitivity. Capable of inspecting up to four 300mm wafers simultaneously at 41 wafers per hour, the system ensures precise defect detection in wafer-level and advanced packaging applications, including bonded wafers, chip-on-wafer assemblies, stacked wafers, MEMS, and over-molded wafers. Its edge scanning capability targets defect-prone areas, optimizing data acquisition and productivity.
The XM8000™ Automated X-Ray Metrology (AXM) system, featuring the QuadraNT tube and detector, enables 2D, 2.5D, and 3D measurements of micron-scale features with exceptional resolution. Designed for high-throughput metrology and defect review, it accurately measures hidden or optically challenging features, such as voids, overlay, and critical dimensions, across wafer-level, panel-level, and advanced packaging applications, including CoWoS, TSVs, 2.5D/3D IC packaging, and wafer bumps.
The 4800 INTEGRA Plus represents the next generation of automated bond test solutions. Its advanced motion, vision, and wafer handling systems, coupled with high-throughput Paragon software, enable precise, hands-free, and fully traceable bond testing for micro bumps and traces on chip-on-wafer, stacked wafer, and molded wafer applications. Equipped with a smart load port and wafer chuck, along with Matrix Map software, the system delivers unmatched accuracy for both 200mm and 300mm wafers.
Back-End Semiconductor Solutions
Nordson’s SQ7000™+ Multi-Function system addresses next-generation applications such as advanced packaging, socket metrology, and memory inspection. Leveraging the Multi-Reflection Suppression® (MRS®) sensor, the system eliminates reflection-based distortions on shiny surfaces, providing rapid, high-precision defect detection and metrology through a comprehensive coordinate measurement software suite.
The SQ3000™M2 Inspection and Metrology system, designed for micro-electronics applications including wire bonds, utilizes Focus Variation Metrology (FVM) technology and high-resolution telecentric optics to deliver superior accuracy and defect coverage.
Dynamic Planar CT™, the next-generation 3D Planar X-Ray inspection software, enhances Nordson’s AXI systems with clearer layer separation, superior data quality, and a faster reconstruction algorithm. Ideal for flip-chip micro bump inspection, it doubles image acquisition speed, reduces cycle times, and lowers sample radiation exposure, while providing an expanded field of view for high-throughput operations.
Advanced ML, DL, and AI Integration
Under the Nordson Intelligence ecosystem, the company continues to push boundaries in Machine Learning (ML), Deep Learning (DL), and Artificial Intelligence (AI). The latest addition, Nordson Sight, offers a full SPC solution with factory-level traceability, historical analysis, and reporting tools. It enables manufacturers to monitor yield, identify defects, and implement rapid corrective actions for optimized processes and improved semiconductor yields.
Nordson Test & Inspection invites attendees to booth 5745 to explore its full range of next-generation semiconductor inspection and metrology solutions, designed to enhance yields, streamline processes, increase throughput, and maximize productivity.
