ITT Completes Public Offering of Common Stock, Underwriters Fully Exercise Additional Share Option
ITT Inc. announced that it has officially completed the closing of its previously declared underwritten public offering of common stock, marking a significant financial milestone for the corporation as it…
Top Gear Honors General Motors with Three Major “Of the Year” Awards
General Motors Adds Three Major Honors from TopGear.com in Its Inaugural U.S. Car Awards Awards season in the automotive world has become an increasingly important benchmark for manufacturers striving to…
Roboworx Highlights Need for Solid Support Systems for Humanoid Robot Growth
As humanoid robots continue their rapid progression from early prototypes to structured pilot programs and, increasingly, to real-world operational deployments, industry leaders are examining not only the pace of technological…
Teradyne Expands Global Robotics Footprint with New Operations Hub in Metro Detroit
Teradyne Robotics Announces Major U.S. Expansion with New Operations Hub in Metro Detroit, Strengthening America’s Advanced Manufacturing Capabilities Teradyne Robotics, widely recognized as a global leader in industrial collaborative robots…
Worthington Steel Ranked Among Computerworld’s Best Places to Work in IT for 2026
Worthington Steel, Inc. announced that it has once again been recognized as one of the premier employers in the information technology field, securing a place on Foundry’s prestigious Computerworld 2026…
Vertical Aerospace, Héli Air Monaco Partner to Launch French Riviera Air Routes
Vertical Aerospace and Héli Air Monaco Partner to Bring Electric Air Mobility to the French Riviera Vertical Aerospace, a global aerospace and technology innovator leading the transition to electric aviation,…
Japanese Manufacturer Installs Gigaphoton Excimer Laser for Next-Generation Advanced Packaging
Gigaphoton Successfully Installs Excimer Laser System for Advanced Semiconductor Packaging at Japanese R&D Facility Gigaphoton Inc., headquartered in Oyama, Tochigi and led by President and CEO Tatsuo Enami, has announced…
UMC Adopts imec’s iSiPP300 Platform to Boost Silicon Photonics for Next-Gen Connectivity
United Microelectronics Corporation (UMC) Announces Licensing Deal with imec to Advance 12-Inch Silicon Photonics Platform for Next-Generation Connectivity United Microelectronics Corporation, commonly known as UMC and recognized globally as one…
ITT Announces Initiation of Underwritten Common Share Offering
ITT Announces Launch of Underwritten Public Offering of Common Stock ITT Inc. announced today that it has formally launched an underwritten public offering of 7,000,000 shares of its common stock,…
Beehive Industries Concludes High-Altitude Trials of Frenzy Engine, Paving the Way for First Flight
Beehive Industries Achieves Major Breakthrough as Frenzy™ Engine Completes High-Altitude Testing, Paving the Way for First Flight in Early 2026 Beehive Industries, a rapidly rising American manufacturer specializing in advanced…
ProAmpac Announces Agreement to Purchase TC Transcontinental’s Packaging Division
ProAmpac to Acquire TC Transcontinental Packaging in a Transformational US$1.51 Billion Deal ProAmpac, a global leader in flexible packaging and advanced material science solutions, announced that it has entered into…
Toshiba Launches New 40V eFuse ICs for Next-Generation Industrial and Consumer Devices
Toshiba Electronic Devices & Storage Corporation has announced a significant expansion of its power protection product lineup with the introduction of the new 40V TCKE6 series of electronic fuses (eFuse…